By Topic

High-Voltage-Tolerant ESD Clamp Circuit With Low Standby Leakage in Nanoscale CMOS Process

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Ming-Dou Ker ; Dept. of Electron. Eng., I-Shou Univ., Kaohsiung, Taiwan ; Chun-Yu Lin

For system-on-chip applications with mixed-voltage I/O interfaces, I/O circuits with low-voltage devices must drive or receive high-voltage signals to communicate with other circuit blocks. With the consideration of low standby leakage in nanoscale CMOS processes, a new 2 × VDD-tolerant electrostatic discharge (ESD) clamp circuit by using only 1 × VDD devices was presented in this paper. The new ESD clamp circuit had a high-voltage-tolerant ESD detection circuit to improve the turn-on efficiency of an ESD clamp device, which consisted of a silicon-controlled rectifier (SCR) with a diode in series. This design had successfully been verified in a 65-nm CMOS process. The leakage current of this ESD clamp circuit under normal circuit operating condition was only on the order of 100 nA. The test patterns with 25- and 50-m SCR-based ESD clamp devices can achieve 2.6- and 4.8-kV human-body-model ESD robustness, respectively. Such high-voltage-tolerant ESD clamp circuits, by using only low-voltage devices with very low standby leakage current and high ESD robustness, were very suitable for mixed-voltage I/O interfaces in nanoscale CMOS processes.

Published in:

Electron Devices, IEEE Transactions on  (Volume:57 ,  Issue: 7 )