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Modeling of electromigration on void propagation at the interface between under bump metallization and intermetallic compound in flip-chip ball grid array solder joints

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3 Author(s)
Jen, M.-H.R. ; Department of Mechanical and Electro-Mechanical Engineering, National Sun Yat-sen University, 70 Lien-hai Rd., Kaohsiung 804, Taiwan, Republic of China ; Lee-Cheng Liu ; Yi-Shao Lai

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.3369442 

A void pattern in Sn4Ag0.5Cu solder joints under EM stressing was empirically obtained at the under bump metallization/intermetallic compound (UBM/IMC) interface. The pattern was associated with current crowding and consumption of the UBM layer. A kinetic model was employed and modified to describe the void propagation at UBM/IMC interface. Based on the continuity condition, the void growth velocity was calculated. The analytical results were in good agreement with the experimental data.

Published in:

Journal of Applied Physics  (Volume:107 ,  Issue: 9 )

Date of Publication:

May 2010

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