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Creating 3D specific systems: Architecture, design and CAD

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3 Author(s)
Paul D. Franzon ; Department of Electrical and Computer Engineering, North Carolina State University, Raleigh 27695, USA ; W. Rhett Davis ; Thor Thorolffson

3D stacking and integration can provide system advantages. Following a brief technology review, this abstract explores application drivers, design and CAD for 3D ICs. The main application area explored in detail is that of logic on memory. This application is explored in a specific DSP example. Finally critical areas that need better solutions are explored. These include design planning, test management, and thermal management.

Published in:

2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010)

Date of Conference:

8-12 March 2010