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Reducing PCB solder process defects and improving PCB solder joint reliability through computer simulation

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3 Author(s)
Hark Byeong Park ; Manuf. Technol. Center, LG Electron. Inc., South Korea ; Soon Kug Hong ; Rob Tomasek

One of the greatest problems facing electronics companies today is the difficulty of successfully transitioning from design to manufacturing. This problem is primarily the result of the combined effect of higher density printed circuit boards, an increase in the functional reliability of both components and assemblies, and an overall miniaturization of products and circuit boards. Additional requirements, such as mass production capabilities and lowering unit costs, require manufacturers to autosolder components onto printed circuit boards and significantly reduce the amount of hand or manual soldering. The design and manufacture of assemblies, which operate reliably at today's complexities, require unique capabilities to validate the design before manufacturing can begin. Computer simulation of circuit designs and manufacturing processes is much less expensive than prototyping. Simulation can uncover design errors before prototyping begins through highly accurate numerical analysis

Published in:

Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE

Date of Conference:

5-7 Mar 1996