Referenced Items are not available for this document.
This paper recalls how the two-port network theory can be extended to 3D conductive heat transfer in multi-layered plane structures. It is shown how efficient computation tools can be built up by implementing this theory with the help of FFT algorithms. These tools are particularly well-suited for the rapid thermal analysis of power components or hybrid and integrated power circuits. An illustration of the thermal analysis of an IGBT power module is also given
Published in:
Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE
Date of Conference: 5-7 Mar 1996
- Page(s):
- 81 - 88
- Meeting Date :
- 05 Mar 1996-07 Mar 1996
- ISSN :
- 1065-2221
- Print ISBN:
- 0-7803-3139-7
- INSPEC Accession Number:
- 5392479
- Conference Location :
- Austin, TX
- Digital Object Identifier :
- 10.1109/STHERM.1996.545096
- Product Type:
- Conference Publications
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