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The interdigital transducer (IDT)/ZnO/metal/diamond structure is investigated for use in the design surface acoustic wave (SAW) devices in the super-high-frequency (SHF) band. Simulation results indicate that adding a metal buffer layer with a finite thickness significantly increases the coupling coefficient. In the Sezawa mode, the coupling coefficient is 4.71% when an Al interlayer is applied. This coupling coefficient is 75% and 77% larger than those in the IDT/ZnO/diamond and IDT/ZnO/shorted surface/diamond structures, respectively. The results in this study are useful in designing SAW devices using diamond-based structures with a large coupling coefficient in the SHF band.