By Topic

Investigation of the Temperature Character of IGBT Solder Delamination Based the 3-D Thermal-Electro Coupling FEM

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Libing Zheng ; Electr. Eng. Inst., Chinese Sci. Acad., Beijing, China ; Li Han ; Jun Liu ; Xuhui Wen

Solder delamination is one of the main failure modes of IGBT module. When the severity of the failure mode is different, the temperature character of IGBT is also different. This paper presents a methodology based on 3D thermal-electro coupling finite elements modeling intended to analyze the relation between the failure degree and the temperature, The results suggest when the area of solder delamination is less than 50% of solder area, IGBT modules are less likely to fail. However when the area of solder delamination is more than 50% of solder area, IGBT modules are more likely to fail. This method and the corresponding results help to evaluate this kind of failure mode how it influences the performance of IGBT, determine the failure, establish the failure standards and find the optimization of structure design.

Published in:

2010 Asia-Pacific Power and Energy Engineering Conference

Date of Conference:

28-31 March 2010