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Solder delamination is one of the main failure modes of IGBT module. When the severity of the failure mode is different, the temperature character of IGBT is also different. This paper presents a methodology based on 3D thermal-electro coupling finite elements modeling intended to analyze the relation between the failure degree and the temperature, The results suggest when the area of solder delamination is less than 50% of solder area, IGBT modules are less likely to fail. However when the area of solder delamination is more than 50% of solder area, IGBT modules are more likely to fail. This method and the corresponding results help to evaluate this kind of failure mode how it influences the performance of IGBT, determine the failure, establish the failure standards and find the optimization of structure design.