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A Vertically Integrated Pixel Readout Device for the Vertex Detector at the International Linear Collider

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8 Author(s)
Deptuch, G. ; Dept. of Particle Phys. Div., Fermi Nat. Accel. Lab., Batavia, IL, USA ; Christian, D. ; Hoff, J. ; Lipton, R.
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Tracking and vertexing in future High-Energy Physics (HEP) experiments involves construction of detectors composed of up to a few billions of channels. Readout electronics must record the position and time of each measurement with the highest achievable precision. This paper reviews a prototype of the first 3D readout chip for HEP, designed for a vertex detector at the International Linear Collider. The prototype features 20 × 20 ¿m2 pixels, laid out in an array of 64 × 64 elements and was fabricated in a 3-tier 0.18 ¿m Fully Depleted SOI CMOS process at MIT-Lincoln Laboratory. The tests showed correct functional operation of the structure. The chip performs a zero-suppressed readout.

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Nuclear Science, IEEE Transactions on  (Volume:57 ,  Issue: 2 )