By Topic

Resistive layers formation during the superconductor-normal transition of high-Tc superconductors

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Ponta, L. ; Phys. Dept., Politec. di Torino, Torino, Italy ; Carbone, Anna ; Gilli, M. ; Mazzetti, Piero

The formation of layers during the resistive transition of granular high-Tc superconductors, characterized by either weak (YBCO-like) or strong (MgB2-like) links, occurs through a series of avalanche-type current density rearrangements. These resistive layers cross the whole specimen approximately orthogonal to the current density direction, and are due to the simultaneous transition of a large number of weak-links or grains. In the present work, strongly and weakly linked networks of nonlinear resistors, with Josephson junction characteristics are considered. It is shown that the exact solution of the Kirchhoff equations yields the subsequent formation of resistive layers within the superconductive matrix as temperature increases. Furthermore, the resistive layer formation process is related to the voltage noise observed at the transition. At the end of the transition, as experimentally found, the layers mix-up, the step amplitude decreases and the resistance curve smoothes. The approach can be extended to networks with arbitrary size and, thus, to real specimens.

Published in:

Science and Technology for Humanity (TIC-STH), 2009 IEEE Toronto International Conference

Date of Conference:

26-27 Sept. 2009