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Presently, stack-dice are used widely as low-power memory applications because thermal management of such 3D architecture as high-power processors inherits many thermal challenges. Inadequate thermal management of 3D-ICs leads to reduction in performance, reliability, and ultimately system catastrophic failure. Heat dissipation of 3D systems is highly non-uniform and non-unidirectional due to many factors such as power architectures, transistors packing density, and real estate available on the chip and on the motherboard. In this study, the development of an experimental model of an active cooling method to cool a 0.4 W/mm2 stack-dice to 13Â°C utilizing a multi-dimensional configured thermoelectric will be presented.
Date of Conference: 21-25 Feb. 2010