Cart (Loading....) | Create Account
Close category search window

Extraction of the capacitance matrix of multiconductor interconnection lines for high-speed IC system design

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Shui-Ping Luo ; Dept. of Electron. Eng., Shanghai Jiaotong Univ., China ; Zheng-Fan Li

A simplified and very effective method for the extraction of the capacitance matrix of multiconductor interconnection lines for high-speed integrated circuit (IC) system design is described in this paper. Because of the combination of the approximate spatial domain Green's function of multilayered dielectric media and the three physically meaningful charge basis functions per conductor edge, preprocessing can take place. Thus, the capacitance matrix can then be quickly computed with high accuracy. Examples show that this method is very efficient and accurate for circuit parameter extraction of high-speed IC interconnect structures

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 4 )

Date of Publication:

Nov 1996

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.