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Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibrational conditions

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1 Author(s)
Lau, J.H. ; Express Packaging Syst., Palo Alto, CA, USA

The thermal, mechanical, and vibrational responses of flip chip and plastic ball grid array (PBGA) solder joints have been determined in this study. The effects of overload environmental stress factors on the mechanical responses of the solder joints have been determined by bending and twisting experiments. The effects of shipping environmental stress factors on the vibrational responses of the solder joints have been determined by out-of-plane vibration experiments. Also, the thermal fatigue behavior of solder joints have been investigated by nonlinear finite element (FE), Coffin-Manson, and fracture mechanics methods

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 4 )