Cart (Loading....) | Create Account
Close category search window

Micromachining of Pyrex7740 glass and their applications to wafer-level hermetic packaging of MEMS devices

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Junwen Liu ; Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing, China ; Qing-An Huang ; Jintang Shang ; Jing Song
more authors

A new wafer-level process to precisely fabricate regular arrays of deep cavities on the Pyrex7740 glass wafer as well as applications to wafer-level hermetic packaging of MEMS devices are presented. The process is based on the anodic bonding, and the Si substrate is employed as a mold layer to form the shape of the cavity. The appropriate processing parameter is obtained from a series of experiments. Finally, the wafer-level hermetic packaging process of MEMS devices is completed by the second anodic bonding process. The whole process has been carried out with dew point sensors in wafer-level and illustrated in detail.

Published in:

Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on

Date of Conference:

24-28 Jan. 2010

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.