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Micromachining of Pyrex7740 glass and their applications to wafer-level hermetic packaging of MEMS devices

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5 Author(s)
Junwen Liu ; Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing, China ; Qing-An Huang ; Jintang Shang ; Jing Song
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A new wafer-level process to precisely fabricate regular arrays of deep cavities on the Pyrex7740 glass wafer as well as applications to wafer-level hermetic packaging of MEMS devices are presented. The process is based on the anodic bonding, and the Si substrate is employed as a mold layer to form the shape of the cavity. The appropriate processing parameter is obtained from a series of experiments. Finally, the wafer-level hermetic packaging process of MEMS devices is completed by the second anodic bonding process. The whole process has been carried out with dew point sensors in wafer-level and illustrated in detail.

Published in:

Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on

Date of Conference:

24-28 Jan. 2010

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