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This paper demonstrates several novel anchor designs for thin film wafer level packaging. Additionally, for the first time, the influence of the anchor design parameters, processing parameters and the choice of the release process on the shear strength of the thin film packages is evaluated. Polycrystalline Silicon-Germanium (poly-SiGe) thin film packages with a sacrificial SiO2 layer are used as test samples. For the majority of the packages the MIL-standard is reached. For the failing packages the cause is identified and understood. Thin film packages with a very small anchor width are strong enough to reach the MIL-standard which leads to smaller packages, less occupied area and thus cost reduction.