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This paper reports a polarization switching antenna integrated with RF MEMS switches based on the novel packaging platform using silicon-on-quartz (SoQ) substrate and BCB(benzocyclobutene) bonding technique. By using the SoQ wafer as an antenna substrate as well as for a packaging lid, fabrication complexity and degradation of RF performances of the antenna due to the parasitic effects coming from the packaging method can be reduced. A fully-packaged K-band antenna capable of switching between two linear polarization states by actuating integrated silicon MEMS switches has been successfully fabricated. Performances of the antenna have been simulated and experimentally evaluated.