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This paper reports a polarization switching antenna integrated with RF MEMS switches based on the novel packaging platform using silicon-on-quartz (SoQ) substrate and BCB(benzocyclobutene) bonding technique. By using the SoQ wafer as an antenna substrate as well as for a packaging lid, fabrication complexity and degradation of RF performances of the antenna due to the parasitic effects coming from the packaging method can be reduced. A fully-packaged K-band antenna capable of switching between two linear polarization states by actuating integrated silicon MEMS switches has been successfully fabricated. Performances of the antenna have been simulated and experimentally evaluated.
Date of Conference: 24-28 Jan. 2010