By Topic

Packaging of LED backlights for ruggedised displays

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Bailey, C. ; Comput. Mech. & Reliability Group, Univ. of Greenwich, London, UK ; Lee, Y. ; Lu, H. ; Strusevich, N.
more authors

Light emitting diodes (LEDs) can provide a number of benefits such as adaptive light control, reduced form factor and other novel techniques to ultimately improve the performance of the display. Some of the design challenges in adopting LEDs are to fully understand their effect on the thermal management, reliability, optical and viewability performance of the display. For the display designer this requires integrated modelling and analysis tools. The paper describes optical and thermal modelling techniques used to predict key design parameters such as luminance and temperature for ruggedized electronic display's using an array of LEDs as the backlight.

Published in:

Advanced Packaging Materials: Microtech, 2010. APM '10. International Symposium on

Date of Conference:

Feb. 28 2010-March 2 2010