By Topic

Multi-Layer Interdigitated Power Distribution Networks

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Jakushokas, R. ; Electr. & Comput. Eng. Dept., Univ. of Rochester, Rochester, NY, USA ; Friedman, E.G.

Higher operating frequencies and greater power demands have increased the requirements on the power and ground network. Simultaneously, due to the larger current loads, current densities are increasing, making electromigration an important design issue. In this paper, methods for optimizing a multi-layer interdigitated power and ground network are presented. Based on the resistive and inductive (both self- and mutual) impedance, a closed-form solution for determining the optimal power and ground wire width is described, producing the minimum impedance for a single metal layer. Electromigration is considered, permitting the appropriate number of metal layers to be determined. The tradeoff between the network impedance and current density is investigated. Based on 65-, 45-, and 32-nm CMOS technologies, the optimal width as a function of metal layer is determined for different frequencies, suggesting important trends for interdigitated power and ground networks.

Published in:

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on  (Volume:19 ,  Issue: 5 )