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Hybrid Integration of a Low-Voltage, High-Current Power Supply Buck Converter With an LTCC Substrate Inductor

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3 Author(s)
Lim, M.H.F. ; Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA ; van Wyk, J.D. ; Lee, F.C.

Miniaturization of hybrid integrated buck converters is impeded by the difference in growth laws in current rating for silicon and for inductors as current rating increases. In the 20 A range, this leads to the attractive feasibility of planarizing the output inductor as the largest component by utilizing low-temperature cofired ceramic technology in the form of the (magnetic) substrate to carry the rest of the converter circuit. The presence of a magnetic substrate below the circuitry creates additional parasitic inductances, which results in low-frequency oscillations. From simulation, the presence of a conductive shield reduces trace inductances and improves circuit performance. There is a minimum shield thickness required to minimize losses associated with ringing. High-shield conductivity is necessary to lower the trace inductance and minimize power loss. Traces should be placed close to the shield to minimize inductance. Experimental results on converters with ceramic-based shield layers and organics-based shield layers bear out the theoretical expectations and establish the practical viability of the proposed hybrid integration technology.

Published in:

Power Electronics, IEEE Transactions on  (Volume:25 ,  Issue: 9 )