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PVD silicon carbide as a thin film packaging technology for antennas on LCP substrates for harsh environments

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5 Author(s)
Scardelletti, M.C. ; NASA Glenn Res. Center, Cleveland, OH, USA ; Stanton, J.W. ; Ponchak, G.E. ; Jordan, J.L.
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This paper describes an effort to develop a thin film packaging technology for microfabricated planar antennas on polymeric substrates based on silicon carbide (SiC) films deposited by physical vapor deposition (PVD). The antennas are coplanar waveguide fed dual frequency folded slot antennas fabricated on liquid crystal polymer (LCP) substrates. The PVD SiC thin films were deposited directly onto the antennas by RF sputtering at room temperature at a chamber pressure of 30 mTorr and a power level of 300 W. The SiC film thickness is 450 nm. The return loss and radiation patterns were measured before and after the SiC-coated antennas were submerged into perchloric acid for 1 hour. No degradation in RF performance or physical integrity of the antenna was observed.

Published in:

Radio and Wireless Symposium (RWS), 2010 IEEE

Date of Conference:

10-14 Jan. 2010