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Capacitively coupled non-contact probing circuits for membrane-based wafer-level simultaneous testing

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11 Author(s)
Daito, M. ; Assoc. of Super-Adv. Electron. Technol., Yokohama, Japan ; Nakata, Y. ; Sasaki, S. ; Gomyo, H.
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A capacitively coupled probing circuit with a de-skewer, a low-pass filter and a weak-feedback receiver realize membrane-based wafer-level simultaneous testing robustly with more than 300 Kpin connections. Both the probe chip and 300 mm DUT-wafer are fabricated in 90 nm and the measured power consumption of RX core is 0.5 mW with BER of 10-12 at 1 Gb/s.

Published in:

Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2010 IEEE International

Date of Conference:

7-11 Feb. 2010