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This whole-day forum offers a complete overview of the existing and emerging 3D-techniques enabling higher interconnectivity between circuit components. It aims to show the advantages of these techniques such as reduced cost, lower power consumption and ease of integration of new generations of System-in-Package (SiP). Designers face different problems which are specific to the application segments such as imagers, battery operated devices, SSD, etc. This forum looks into these problems and presents different 3D-solutions.