Cart (Loading....) | Create Account
Close category search window
 

Accurate and Analytical Statistical Spatial Correlation Modeling Based on Singular Value Decomposition for VLSI DFM Applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Jui-Hsiang Liu ; Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei, Taiwan ; Ming-Feng Tsai ; Lumdo Chen ; Chen, C.C.-P.

With the significant advancement of statistical timing and yield analysis algorithms, there is a strong need for accurate and analytical spatial correlation models. In this paper, we propose a novel spatial correlation modeling method that can not only capture the general spatial correlation relationship but also can generate highly accurate and analytical models. Our method, based on singular value decomposition, can generate sequences of polynomial weighted by the singular values. Experimental results from foundry measurement data show that our proposed approach is 3x accuracy improvement over several distance based spatial correlation modeling methods.

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:29 ,  Issue: 4 )

Date of Publication:

April 2010

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.