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Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules

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8 Author(s)
Gong Yue Tang ; United Test & Assembly Center, Ltd., Singapore, Singapore ; Siow Pin Tan ; Khan, N. ; Pinjala, D.
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In this paper, an integrated liquid cooling system for 3-D stacked modules with high dissipation level is proposed. The fluidic interconnects in this system are elaborated and the sealing technique for different fluid interfaces is discussed. Meanwhile, the pressure drop for each part of the system is analyzed. The optimized fluidic interconnects minimizing the pressure drop have been designed and fabricated, and the compact system is integrated. In line with the fluidic interconnect design and analysis, an experimental process for hydraulic characterization of the integrated cooling system is established. The pressure drops for different fluidic interconnects in this system are measured and compared with the analyzed results.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:33 ,  Issue: 1 )

Date of Publication:

March 2010

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