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Chip-Package Hierarchical Power Distribution Network Modeling and Analysis Based on a Segmentation Method

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7 Author(s)
Jaemin Kim ; Terahertz Interconnection & Package Lab., KAIST, Daejeon, South Korea ; Woojin Lee ; Yujeong Shim ; Jongjoo Shim
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In this paper, a new modeling method for estimating the impedance properties in a chip-package hierarchical power distribution network (PDN) is proposed. The key ideas of the proposed modeling method are to decompose the chip-package hierarchical PDN into several structures, independently calculate the decomposed structures, and extract the whole structure's impedance by using a segmentation method. For the impedance calculations of the independently decomposed structures, a new method based on proposed analytic expressions is introduced for a chip level PDN, a resonant cavity model is used for a package level PDN, and equivalent circuit models are used for interconnections. The proposed method has been successfully verified by comparisons with measurements using a fabricated test vehicle in the frequency domain range up to 20 GHz, and it shows improved accuracy as well as computational superiority compared to EM simulations. Finally, the impedance properties in a chip-package hierarchical PDN are thoroughly investigated and analyzed.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:33 ,  Issue: 3 )

Date of Publication:

Aug. 2010

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