By Topic

Design and Characterization of Thin-Film System for Microsensors Embedding in Ti6Al4V Alloys

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Xugang Zhang ; Johnson Controls-Saft Advanced Power Solutions, Milwaukee, WI, USA ; Xiaochun Li

Reliable structures and systems are critical for numerous engineering applications. These systems are generally operated in harsh environments. Effective monitoring and diagnosis of these structures are of critical importance. To achieve this goal, thin-film micro/nano sensors can be embedded in metal structures to protect them from external harsh environments while providing measurements with desired special and temporal resolutions and accuracy, which cannot be achieved with traditional sensors. Targeting on new sensor applications in harsh environments, this paper presents experimental results on the design and characterization of a thin-film system, including diffusion barrier and insulation layers, for a successful sensor embedding in Ti6Al4V alloy through diffusion bonding. Based on the developed material system, an effective fabrication process of the Ti6Al4V-embedded thin-film PdCr strain gages was developed. The embedded sensors were validated by a functionality test and material characterization.

Published in:

IEEE Sensors Journal  (Volume:10 ,  Issue: 4 )