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Preparation and dielectric properties of epoxy/silica nanocomposites

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5 Author(s)
Huicheng Shi ; State Key Lab. of Electr. Insulation & Power Equip., Xi''an Jiaotong Univ., Xi''an, China ; Naikui Gao ; Haiyun Jin ; Bangfa Chen
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In this paper, epoxy resin based composites filled with nano-silica were fabricated. The relationships between the dielectric properties as well as glass transition temperature (Tg) and nano-filler content were investigated. The results showed that, relative permittivity (¿r) and dielectric loss tangent (tan¿) decreased when filler content was no more than 0.3 wt.%, and reached minimum value at 0.3 wt.%, but above this filler loading, ¿r and tan¿ started to increase with increasing filler content. The DC volume resistivity decreased with the introduction of nano-silica, and the value of Tg did not appear to change significantly with filler content.

Published in:

Nanoelectronics Conference (INEC), 2010 3rd International

Date of Conference:

3-8 Jan. 2010

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