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Wetting behaviour of lead free solder on electroplated Ni and Ni-W alloy barrier film

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3 Author(s)
C. S. Chew ; Department of Mechanical Engineering, University of Malaya, 50603 Kuala Lumpur, Malaysia ; A. S. M. A. Haseeb ; M. R. Johan

In this work, electrodeposited of Ni-W alloys were studied as barrier films between Cu substrate and lead free Sn3.8Ag0.7Cu (SAC387) solder. Wetting angle and spreading rate of SAC387 on Ni-W alloys with different tungsten contents were investigated and compared with that on Ni film deposited from Watt's bath. Ni-W alloy films of about 1.5 to 2.5 ¿m were deposited from ammonia-citrate bath on copper substrate. Results show solder/Ni-W alloy system and solder/Ni system exhibited almost the same spreading rate and wetting angle.

Published in:

2010 3rd International Nanoelectronics Conference (INEC)

Date of Conference:

3-8 Jan. 2010