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In this work, electrodeposited of Ni-W alloys were studied as barrier films between Cu substrate and lead free Sn3.8Ag0.7Cu (SAC387) solder. Wetting angle and spreading rate of SAC387 on Ni-W alloys with different tungsten contents were investigated and compared with that on Ni film deposited from Watt's bath. Ni-W alloy films of about 1.5 to 2.5 Â¿m were deposited from ammonia-citrate bath on copper substrate. Results show solder/Ni-W alloy system and solder/Ni system exhibited almost the same spreading rate and wetting angle.