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We demonstrate electrically functional 0.099 μm2 6T-SRAM cells using full-field EUV lithography for contact and M1 levels. This enables formation of dense arrays without requiring any OPC/RET, while exhibiting substantial process latitudes & potential lower cost of ownership (single-patterning). Key enablers include: 1) high-k/metal gate FinFETs with Lg˜40 nm, 12-17 nm wide Fins, and cell β ratio ˜1.3; 2) option for using an extension-less approach, advantageous for reducing complexity with 2 less I/I photos, and for enabling a better quality, defect-free growth of Si-epitaxial raised S/D; 3) use of double thin-spacers and ultra-thin silicide; 4) optimized W metallization for filling high aspect-ratio, ⩾30 nm-wide contacts. SRAM cell with SNM≫10%VDD down to 0.4V, and healthy electrical characteristics for the cell transistors [SS˜80 mV/dec, DIBL˜50-80 mV/V, and |VTlin|⩾0.2 V (PMOS), VTlin˜0.36 V (NMOS)] are reported.