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In this paper we demonstrate functional 3D circuits obtained by a 3D Stacked IC approach using both Cu Through Silicon Vias (TSV) First and cost effective solution Die-to-Wafer Hybrid Collective bonding. The Cu TSV-First process is inserted between contact and M1. The top die is thinned down to 25 ¿m and bonded to the landing wafer by Hybrid Bonding. Measurements and simulations of the power delay trade-offs of various 3D Ring Oscillator are provided as a demonstration of the relevance of such process route and of the design/simulation capabilities.
Published in:
Electron Devices Meeting (IEDM), 2009 IEEE International
Date of Conference: 7-9 Dec. 2009
- Page(s):
- 1 - 4
- E-ISBN :
- 978-1-4244-5640-6
- Print ISBN:
- 978-1-4244-5639-0
- INSPEC Accession Number:
- 11207464
- Conference Location :
- Baltimore, MD
- Digital Object Identifier :
- 10.1109/IEDM.2009.5424351
- Product Type:
- Conference Publications
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