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In this paper, we present FD-SOI with High-K and Single Metal gate as a possible candidate for LP multimedia technology. Dual gate oxide co-integrated devices with EOT 17 Â¿/Vdd 1.1 V and 29 Â¿/Vdd 1.8 V are reported. The interest of Ultra-Thin Buried Oxide substrates (UTBOX) is reported in term of Multiple Vt achievement and matching improvement. Delay improvement up to 15% is reported on Ring Oscillators as compared to bulk 45 nm devices. In addition, for the first time 99.998% 2 Mbit 0.374 Â¿m2 SRAM cut functionality has been demonstrated. Thanks to a hybrid FDSOI/bulk co-integration with UTBOX all IP's required in a SOC are demonstrated for LP applications.