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Method for system-level signal and power integrity modeling of high-speed electronic packages

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6 Author(s)
En-Xiao Liu ; Adv. Electromagn. & Electron. Lab., A*STAR Inst. of High Performance Comput., Singapore, Singapore ; Xingchang Wei ; Zaw Zaw Oo ; Yao-Jiang Zhang
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This paper reported the latest development of the modal decomposition with T-matrix method for accurate and efficient analysis of coupling of multiple vias in finite-sized multilayered parallel-plate structures. A novel boundary modeling method, named the frequency-dependent cylinder layer (FDCL), is proposed to resolve the open problem of boundary modeling associated with modal expansion methods. Moreover, a generalized T matrix model derived by the mode matching technique, is created to characterize the coupling effect for vias penetrating more than one layer in a multilayered structure. Both numerical and experimental verifications are presented to validate the new modeling methods. The above method has been incorporated into the simulation tool developed recently by us.

Published in:

Electronics Packaging Technology Conference, 2009. EPTC '09. 11th

Date of Conference:

9-11 Dec. 2009