Cart (Loading....) | Create Account
Close category search window

Evaluating the effects of electromigration by using adjustable solder joints of concave shape

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Jaeschke, J. ; Forschungsschwerpunkt Technol. der Mikroperipherik, Tech. Univ. Berlin, Berlin, Germany ; Kleff, J. ; Muller, W.H. ; Nissen, N.F.
more authors

Further miniaturization of electronic systems is approaching new limits due to the failure mechanism of electromigration. Electromigration results in a transport of material in solder joints subjected to high electrical current densities. This decreases the system reliability and, therefore, it is necessary to assess and quantify this failure mechanism in solder joints. In this paper we discuss the development of new test structures based on modified flip chip structures, which allow monitoring of electromigration effects in lead-free solder joints. The structures are of concave shape which permits shifting of the failure region within the solder joint into a position suitable for deterministic assessment. For example it thus becomes possible to create a nearly homogeneous distribution of current density in the local failure region remote from interfering Inter-Metallic Compounds (IMCs) and material interfaces. Moreover, a smaller electric current is required to reach high current densities, so that Joule heating decreases. As a result the effects of overlying failure mechanisms are reduced to two main factors of influence, namely current density and temperature. Experiments using SnAg3.5 solder joints have been conducted at temperatures from 100°C to 150°C and current densities from 104 A/cm2 to 7.7×104 A/cm2. Joule heating is evaluated by finite element analysis (FEA) and measured during experiment. The activation energy is found to be 1.32 eV. A scanning electron microscope (SEM) is used to analyze failure characteristics of the structures and a direct comparison of the impacts of electromigration and thermomigration is performed. The results demonstrate the advantages mentioned before and qualify the structures for electromigration research.

Published in:

Electronics Packaging Technology Conference, 2009. EPTC '09. 11th

Date of Conference:

9-11 Dec. 2009

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.