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Decoupled victim model for the analysis of crosstalk noise between on-chip coupled interconnects

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3 Author(s)
Ajoy K. Palit ; FB1/ITEM, University of Bremen, P.O. Box - 330 440, 28 334 Bremen, Germany ; Shehzad Hasan ; Walter Anheier

Crosstalk noise due to parasitic couplings between two closely located neighboring wires has significant impact on the performance of the high speed DSM chips. Analysis of crosstalk effect using a single wire with all of its coupling parameters is much easier and very convenient for determining the maximum effect of the crosstalk noise both in terms of glitch and delay. With this objective, in this paper a decoupled and distributed RLGC transient model of the victim wire is introduced which takes into account all coupling effects and is very fast, highly flexible and yet accurate enough. Using this decoupled victim model also some analytical or numerical approaches for determining the critical values of influencing parameters can be developed. The efficacy of the decoupled victim model is also compared with the coupled two interconnects' PSPICE and MATLAB simulation results, which show comparable performance for the model's accuracy but significantly superior performance for simulation speed.

Published in:

Electronics Packaging Technology Conference, 2009. EPTC '09. 11th

Date of Conference:

9-11 Dec. 2009