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Electromagnetic interference suppression and simultaneous switching noise mitigation in system on package using a lowpass filter structure with embedded capacitor

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6 Author(s)
Lei Li ; Shenzhen Inst. of Adv. Integration Technol., Chinese Univ. of Hong Kong, Hong Kong, China ; Yunfeng Wang ; Lixi Wan ; Xiaoli Liu
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System on package (SOP) is an emerging technology, and provides an implementation options for system with small size, especially for mixed-signal systems. However, in such a compact package, noise generated by the digital chip can be easily coupled to the RF IC, and degrade the sensitivity of RF signal. In this paper, a simple and efficient multi-order lowpass filter for EMI and SSN suppression in system on package is implemented with embedded capacitor material. It has good performance in noise isolation with a small size of 10mm*mm. The lowpass filter is designed and simulated by electromagnetic analysis software, HFSS. The insertion loss is below -70dB from 1.5GHz to 10GHz. Then, the lowpass filter is serial with a surface mounted 47nH inductor, and can achieve noise suppression below -50dB from 50MHz to 10GHz, below -60dB from 140MHz to 10GHz, and below -80dB from 600MHz to 10GHz. That is very promising for system on package application in mixed-signal systems. The structure can also be used in large scale backplanes or motherboards.

Published in:

Electronics Packaging Technology Conference, 2009. EPTC '09. 11th

Date of Conference:

9-11 Dec. 2009

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