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The following topics are dealt with: copper wirebonding; flip chip interconnection; lead free solders; signal integrity; power integrity; thermal modelling; thermal characterization; manufacturing process; wafer level packaging; structural integrity; substrates; silicon technology; solder joint reliability; molding; encapsulation; electromigration; through silicon vias; drop impact reliability; die attach; light emitting diodes and optoelectronic packaging.

Published in:

Electronics Packaging Technology Conference, 2009. EPTC '09. 11th

Date of Conference:

9-11 Dec. 2009