Cart (Loading....) | Create Account
Close category search window

Health monitoring method of note PC for cooling performance degradation and load assessment

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Hirohata, K. ; Corp. R&D Center, Toshiba Corp., Kawasaki, Japan ; Hisano, K. ; Mukai, M.

Health monitoring technologies, which can evaluate the performance degradation, load history and degree of fatigue, have the potential to improve the effective maintenance, the reliability design method and the availability in the improper use conditions of digital equipment. In this paper, we propose a method to assess the cooling performance degradation and load history of printed circuit boards in digital equipment by use of a hierarchical Bayes model based on CAE (Computer Aided Engineering) results of thermal stress simulation and experiment data from actual measurements. We applied this method to note PC that can monitor the device load factor and revolution number of cooling fan. It is shown that this method can estimate the temperature and deformation distribution of the printed circuit board from monitoring variables through latent variables such as thermal dissipation of the device and thermal boundary condition by use of the hierarchical Bayes model. And it is confirmed that the statistical load assessment concerning thermal cyclic load and the maximum load distribution can be conducted using the estimated temperature and deformation data. Furthermore, we verified that the cooling performance degradation can be assessed, if the temperature difference per unit thermal value between two suitable points on the printed circuit board can be obtained. It is concluded that the proposed method can be effective to assess the thermal load history and cooling performance degradation.

Published in:

Prognostics and Health Management Conference, 2010. PHM '10.

Date of Conference:

12-14 Jan. 2010

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.