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Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation

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3 Author(s)
Tzong-Lin Wu ; Department of Electrical Engineering and Graduate Institute of Communication Engineering, National Taiwan University , Taipei, China ; Hao-Hsiang Chuang ; Ting-Kuang Wang

Mitigating power distribution network (PDN) noise is one of the main efforts for power integrity (PI) design in high-speed or mixed-signal circuits. Possible solutions, which are based on decoupling or isolation concept, for suppressing PDN noise on package or printed circuit board (PCB) levels are reviewed in this paper. Keeping the PDN impedance very low in a wide frequency range, except at dc, by employing a shunt capacitors, which can be in-chip, package, or PCB levels, is the first priority way for PI design. The decoupling techniques including the planes structure, surface-mounted technology decoupling capacitors, and embedded capacitors will be discussed. The isolation approach that keeps part of the PDN at high impedance is another way to reduce the PDN noise propagation. Besides the typical isolation approaches such as the etched slots and filter, the new isolation concept using electromagnetic bandgap structures will also be discussed.

Published in:

IEEE Transactions on Electromagnetic Compatibility  (Volume:52 ,  Issue: 2 )