By Topic

Definition of an innovative filling structure for digital blocks : the DFM filler cell

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Laurent Remy ; ATMEL Rousset, Avenue Olivier Perroy, France ; Philippe Coll ; Fabrice Picot ; Philippe Mico
more authors

A DFM approach considers all interactions in the production flow and breaks the standard local/global context. Understanding existing solutions and their limitations in filling solution for digital blocks, we present in this paper a DFM filler cell solution that takes into account a large amount of problems that can be encountered at many steps of the production flow, such as lithography or planarity variations, while other kinds of filler cells only solve density problems. This allows designs to be less dependent on the global context of the digital block. Our DFM filler cell reduces the STI width stress impact, contains dummy polysilicon gates that allow an OPC-friendly approach and is more flexible for the place and route step. Our approach was validated by a silicon structure and many published data in this domain. The insertion of DFM filler cells is costless in terms of area thanks of their size that are multiple of the grid size. Furthermore, the usage of DFM filler cell in the complete design flow was validated.

Published in:

Electronics, Circuits, and Systems, 2009. ICECS 2009. 16th IEEE International Conference on

Date of Conference:

13-16 Dec. 2009