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Application of the thermal network method to the transient thermal analysis of multichip modules

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4 Author(s)
Ishizuka, M. ; Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan ; Hisano, K. ; Sasaki, T. ; Fukuoka, Y.

In recent years, there has been a growing demand to have smaller and lighter electronic circuits with greater complexity, multifunctionality and reliability. High-density multichip packaging technology has been used to meet these requirements. The higher the density scale is, the larger the power dissipation per unit area becomes. Therefore, in thermal design process it has become very important to carry out the thermal analysis. However, the heat transport model in multichip modules is complex and its treatment is tedious and time consuming. This paper describes an application of the thermal network method to the transient thermal analysis of multichip modules and proposes a simple model for the thermal analysis of multichip modules as a preliminary thermal design tool

Published in:

Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International

Date of Conference:

4-6 Dec 1995