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Fine pitch TAB/OLB (Tape Automated Bonding/Outer Lead Bonding) technology by soldering method through non-cleaning process

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4 Author(s)
Matsubara, H. ; Precision Technol. Dev. Centre, Sharp Corp., Nara, Japan ; Sakamoto, Y. ; Yamamura, K. ; Nukii, T.

The developed technology made it possible to bond the outer leads of the TCP (Tape Carrier Package) at 0.15 mm pitch onto a substrate without a solder supply on the substrate electrodes, which reduces the substrate cost and simplifies the wiring pattern on the substrate, thereby decreasing the electronic noise due to the common electrode pattern for electro-plating. We studied the bonding conditions, materials, reliability and repair techniques, and we confirmed that the technology can be put into practical use

Published in:

Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International

Date of Conference:

4-6 Dec 1995