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Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibration conditions

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1 Author(s)
Lau, J.H. ; Hewlett-Packard Co., USA

The thermal, mechanical and vibration responses of flip chip and PBGA (Plastic Ball Grid Array) solder joints have been determined in this study. The effects of overload environmental stress factors on the mechanical responses of the solder joints have been determined by bending and twisting experiments. The effects of shipping environmental stress factors on the vibration responses of the solder joints have been determined by out of plane vibration experiments. Also, the thermal fatigue behavior of solder joints have been investigated by nonlinear finite element, Coffin-Manson, and fracture mechanics methods

Published in:

Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International

Date of Conference:

4-6 Dec 1995