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Abstract-In this paper, we present the bulk acoustic wave (BAW), the sound-electricity reclamation (SER), and the insertion loss as the three key problems of a wavelet transform processor using surface acoustic wave devices. The solutions to these problems are achieved in this study. The more the number of electrode pairs for the interdigital transducer (IDT) is, the weaker the excited BAW is, so the BAW can be eliminated when the number of electrode pairs for IDT is large enough. The substrate material of a small electromechanical coupling coefficient (ECC) k2 and the low-impedance load of IDT can eliminate SER. When the output ends of the wavelet transform processors are respectively connected to the amplifiers, their insertion losses can be compensated. X-112oY LiTaO3 (small ECC k2) is used as a substrate material to fabricate the wavelet transform processor.