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Possible methods of increasing the sensitivity capabilities for determining heat-transfer rates associated with wind tunnel testing have been investigated. Techniques utilizing surface thermocouples of conventional thermocouple materials do not provide the necessary temperature sensitivity to low heat-transfer rates. This need for increased sensitivity has resulted in development and evaluation of surface thermocouples fabricated from semiconductor materials. Calibration of the semiconductor surface thermocouple has disclosed temperature sensitivity on the order of 35 times that of chromel-constantan thermocouples. This increased sensitivity has established confidence in the potential value of this concept and further investigation and evaluation are presently being conducted.