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Low cost camera modules using integration of wafer-scale optics and wafer-level packaging of image sensors

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2 Author(s)
Hongtao Han ; Tessera North America, 9815 David Taylor Drive, Charlotte, NC, USA 28262 ; Keith Main

Using wafer scale optics, wafer scale integration, and wafer level packaging of image sensor, we developed small form factor (3.3mm×3.3mm×2.5mm), low manufacturing cost, Pb-free solder reflow compatible digital camera modules which are suitable for many applications including mobile electronic devices, automotives, security, and medical applications.

Published in:

2009 Asia Communications and Photonics conference and Exhibition (ACP)  (Volume:2009-Supplement )

Date of Conference:

2-6 Nov. 2009