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Novel electrical modelling and measurement technique of hybrid package (FusionQuad) for characterization of RF and high speed signals

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6 Author(s)
SeungJae Lee ; Amkor Technology Korea, Inc. R&D Center, 280-8, 2-ga, Sungsu-dong, Sungdong-gu, Seoul 133-706, Korea ; KiCheol Bae ; Jiheon Yu ; YoungSuk Chung
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This paper discuss electrical characterization of new developed hybrid package, FusionQuad, that is converging QFN and TQFP type package to have good electrical performance with high I/O pin counts. Precise electrical modelling from wire-to-motherboard is performed by using simple organic based test die with de-embedding technique to cope with limits of assembly process. Measurements are done in the frequency domain to extract S-parameter up to 10 GHz.

Published in:

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)

Date of Conference:

2-4 Dec. 2009