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Novel electrical modelling and measurement technique of hybrid package (FusionQuad) for characterization of RF and high speed signals

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6 Author(s)
SeungJae Lee ; R&D Center, Amkor Technol. Korea, Inc., Seoul, South Korea ; KiCheol Bae ; Jiheon Yu ; YoungSuk Chung
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This paper discuss electrical characterization of new developed hybrid package, FusionQuad, that is converging QFN and TQFP type package to have good electrical performance with high I/O pin counts. Precise electrical modelling from wire-to-motherboard is performed by using simple organic based test die with de-embedding technique to cope with limits of assembly process. Measurements are done in the frequency domain to extract S-parameter up to 10 GHz.

Published in:

Electrical Design of Advanced Packaging & Systems Symposium, 2009. (EDAPS 2009). IEEE

Date of Conference:

2-4 Dec. 2009