Skip to Main Content
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, is one of the promising solutions to mitigate the interconnect problem in modern microprocessor designs. 3D memory stacking also enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the ``memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovation designs for future microprocessors. This paper serves as a survey of various approaches to design future 3D microprocessors, leveraging the benefits of fast latency, higher bandwidth, and heterogeneous integration capability that are offered by 3D technology.