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An estimation method of electroplating current densities in LSI fabrication technology by inverse analysis of electric potentials in cells

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3 Author(s)
Kishimoto, Y. ; Grad. Sch. of Inf. Sci. & Eng., Tokyo Inst. of Technol., Tokyo, Japan ; Amaya, K. ; Hayabusa, K.

In this paper, we have developed a novel technique to estimate electroplating current densities from electric potentials in plating cells for LSI fabrication technology. This technique applies inverse analysis process for the estimation. We have also built a device for measuring electric potentials in the plating cell. Measurement experiments under several electroplating conditions were performed to demonstrate the validity of the proposed technique.

Published in:

Sensors, 2009 IEEE

Date of Conference:

25-28 Oct. 2009

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