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In this paper, we have developed a novel technique to estimate electroplating current densities from electric potentials in plating cells for LSI fabrication technology. This technique applies inverse analysis process for the estimation. We have also built a device for measuring electric potentials in the plating cell. Measurement experiments under several electroplating conditions were performed to demonstrate the validity of the proposed technique.
Sensors, 2009 IEEE
Date of Conference: 25-28 Oct. 2009