Close category search window
 

Scalable and low power LDPC decoder design using high level algorithmic synthesis

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Yang Sun ; Depart. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA ; Cavallaro, J.R. ; Tai Ly

This paper presents a scalable and low power low-density parity-check (LDPC) decoder design for the next generation wireless handset SoC. The methodology is based on high level synthesis: PICO (program-in chip-out) tool was used to produce efficient RTL directly from a sequential un-timed C algorithm. We propose two parallel LDPC decoder architectures: (1) per-layer decoding architecture with scalable parallelism, and (2) multi-layer pipelined decoding architecture to achieve higher throughput. Based on the PICO technology, we have implemented a two-layer pipelined decoder on a TSMC 65 nm 0.9 V 8-metal layer CMOS technology with a core area of 1.2 mm2. The maximum achievable throughput is 415 Mbps when operating at 400 MHz clock frequency and the estimated peak power consumption is 180 mW.

Published in:
SOC Conference, 2009. SOCC 2009. IEEE International

Date of Conference: 9-11 Sept. 2009

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.