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This paper presents a scalable and low power low-density parity-check (LDPC) decoder design for the next generation wireless handset SoC. The methodology is based on high level synthesis: PICO (program-in chip-out) tool was used to produce efficient RTL directly from a sequential un-timed C algorithm. We propose two parallel LDPC decoder architectures: (1) per-layer decoding architecture with scalable parallelism, and (2) multi-layer pipelined decoding architecture to achieve higher throughput. Based on the PICO technology, we have implemented a two-layer pipelined decoder on a TSMC 65 nm 0.9 V 8-metal layer CMOS technology with a core area of 1.2 mm2. The maximum achievable throughput is 415 Mbps when operating at 400 MHz clock frequency and the estimated peak power consumption is 180 mW.
SOC Conference, 2009. SOCC 2009. IEEE International
Date of Conference: 9-11 Sept. 2009