This paper presents new results on integrated devices for radio and free-space optical dual-mode communication. Two novel hybrid packaging schemes using two different microwave printed antenna designs are presented for the integration of radio-optical front-end circuits on a planar compact printed circuit board with shared electrical and structural components. Full-wave electromagnetic (EM) simulations are presented for antenna optimization to minimize EM interference between the radio and optical circuits. A hybrid radio-optical package design is developed, prototyped, and experimentally studied using a modified quasi-Yagi antenna with split directors to form pads for opto-electronic device integration. Dual-mode link connectivity is investigated in simulations and experiments. A data rate of 2.5 Gb/s is demonstrated for the optical channel despite 15-20-dB signal coupling between the optical and microwave circuits.
Published in:
Microwave Theory and Techniques, IEEE Transactions on
(Volume:58
,
Issue:
2
)
Date of Publication: Feb. 2010